Semiconductor Wafer Processing

The PDMS series of air-bearing precision spindles leverage the characteristic of gas viscosity, which is only 1/1000 of regular lubricating oil, combined with an air pressure flow channel design. This creates an air pressure bearing within the spindle that provides load-bearing rigidity. With eco-friendly, high-speed, and smart features, the PDMS series meets the requirements for semiconductor wafer processing, such as dicing, thinning, and polishing, making it an ideal choice for the localization of semiconductor manufacturing components.